The Next Power-Supply War Is Moving Inside the Package
Integrated voltage regulators are pulling thin-film magnetic power inductors into the package, changing how AI and GPU platforms think about power density, transient response, and board space.
Integrated voltage regulators are pulling thin-film magnetic power inductors into the package, changing how AI and GPU platforms think about power density, transient response, and board space.
Ripple current is a lifetime problem hiding inside power supplies, and SPICE-based FFT analysis gives engineers a practical way to estimate capacitor stress before heat wins.
AI servers are pushing high-end MLCC demand toward capacity limits, exposing how small passive components can become a serious constraint in the data-center hardware race.
AI accelerators are lifting silicon capacitors from a niche packaging detail into a premium supply-chain item tied to wafer capacity and long-term contracts.
A capacitive position-sensing approach using sensor-to-reference capacitance ratios highlights how simple analog building blocks can still deliver precise motion insight.