ABF 載板需求超過供給逾 50%，三星千億美元擴產押注越南。誰會是這場 ABF 產能大戰的最大受益者？被動元件廠該如何佈局？

Samsung Electro-Mechanics announced an investment of 1.8 trillion won in Vietnam to expand its ABF substrate production capacity. As the market gap—where demand exceeds supply by more than 50%—is abou…

玻纖布與銅箔同步上漲，CCL 成本壓力在 2026 年下半年將逐步傳導至被動元件報價。台灣廠商誰最危險？採購如何提前因應？

Analog and passive components are nearly impossible to trace once integrated into systems — and that is becoming a national security problem for critical infrastructure.

Bourns SRP2008DP 用金屬合金粉末磁芯突破鐵氧體的磁飽和瓶頸，0.8mm 超薄封裝，专為高功率密度 DC-DC 設計者而生。

Bourns SRP2008DP uses metal alloy powder core instead of ferrite to deliver high current in an ultra-thin 0.8mm profile — a meaningful shift for high-density DC-DC converter designers.

TDK MAF0603GWY 用新配方鐵氧體在 5GHz 高頻EMI 環境下同時保住音頻品質——這個工程師多年無法同時解決的問題，現在終於有解。

TDK’s MAF0603GWY uses a new low-distortion ferrite material to silence EMI without killing audio quality — a combination that’s eluded engineers for years.

類比與被動元件一旦整合進系統就很難溯源，這正在成為關鍵基礎設施的國安危機。Physical ID 技術能否扭轉局勢？

白銀、銅、錫價格齊漲，台灣被動元件廠面臨新一輪成本壓力，漲價潮已從鉭電容擴散至電感與壓敏電阻，MLCC 預計年中跟進。